Showing posts with label Solder Join. Show all posts
Showing posts with label Solder Join. Show all posts

Saturday, October 31, 2009

Troubleshoot Electronic Circuit ( Lesson 4) - - - Contact Issue

Salam,

Lesson 4: Contact Issue


What is "Contact Issue"?

Contact issue is related on solder joint. Failure mode might categorized as contact issue if fail to operate at hot temperature only. But remember not all problem that occur on hot temperature is related on contact issue.

How it can happen?
The solder joint will expense at hot temperature (certain temperature) and re-expense at room or cold temperature.

How to investigate it?
1). Heat up the electronic device up to certain minutes than measure (voltage & resistance) the suspected area. Make measurement(s) comparison before heat up (room temperature) and after heat up (hot temperature).
2). Screening the electronic device under XRAY. <This method is suggested if really need deep analysis or evidance.

Tuesday, September 15, 2009

Troubleshoot Electronic Circuit (Lesson 1) - - - VMI

Salam,

Lesson 1: VMI (Visual Mechanical Inspection)



What is the purpose doing VMI?
To find out physical defect on electronic circuit.

Why?
Most of the functional failure can cause from hardware failure and software failure. The hardware failure more easier to identified if compare with software failure.

How to do VMI?
By doing physical inspection using microscope (30X zoom) to identified the physical defect such as Expose Copper, Crack, Solder Bridging, Solder Join, Melt, Explode, Burn, Shorted and others.

Why need microscope?
It much easier to inspect defect on SMD's Components(Surface Mounted Device). Naked eye difficult to recognize failure defect on extra small components.

all this remind me to this proverb: "Jika tiada angin masakan pokok bergoyang". Hope you get what i meant?